3D system-in-package design using stacked silicon submount technology
Author:
Dong Mingzhi,Santagata Fabio,Sokolovskij Robert,Wei Jia,Yuan Cadmus,Zhang Guoqi
Abstract
Purpose
– This study aims to provide a flexible and cost-effective solution of 3D heterogeneous integration for applications such as micro-electro-mechanical system (MEMS) applications and smart sensor systems.
Design/methodology/approach
– A novel 3D system-in-package (SiP) based on stacked silicon submount technology was successfully developed and well-demonstrated by the fabrication and assembly process of a selected smart lighting module.
Findings
– The stacked module consists of multiple layers of silicon submounts which can be designed and fabricated in parallel. The bonding and interconnecting process is quite simple and does not require complicated equipment. The 3D stacking design offers higher silicon efficiency and miniaturized package form factor. The submount wafer can be assembled and tested at the wafer level, thus reducing the cost and improving the yield.
Research limitations/implications
– The embedding design presented in this paper is applicable for modules with limited number of passives. When it comes to cases with more passive devices, new process needs to be developed to achieve fast, inexpensive and reliable assembly.
Originality/value
– The presented 3D SiP design is novel for applications such as smart lighting, Internet of Things, MEMS systems, etc.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference21 articles.
1. Arnold, W.H.III
,
Farnaam, M.
and
Sliwa, J.
(1989), “Titanium nitride as an antireflection coating on highly reflective layers for photolithography”, US Patent No. 4,820,611, US Patent and Trademark Office, Washington, DC. 2. Augusto, J.C.
,
Nakashima, H.
and
Aghajan, H.
(2010), “Ambient intelligence and smart environments: a state of the art”,
Handbook of Ambient Intelligence and Smart Environments
, Springer, New York, NY, pp. 3-31. 3. Dong, M.
,
Santagata, F.
,
Wei, J.
,
Yuan, C.
and
Zhang, G.
(2014), “Novel system-in-package design and packaging solution for solid state lighting systems”, Proceedings of Electronic Components and Technology Conference, Orlando, FL, 27-30 May, IEEE, pp. 1192-1197. 4. Fontanelli, A.
(2008), “System-in-package technology: opportunities and challenges”, Proceedings of International Symposium Quality Electronic Design, San Jose, CA, 17-19 March, IEEE, pp. 589-593. 5. French, P.J.
and
Sarro, P.M.
(2010), “Integrated MEMS: opportunities & challenges”,
Micromachining Techniques for Fabrication of Micro and Nano Structures
, Vol. 2 No. 1, pp. 253-276.
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
|
|