Evaluation of the Degradation in Electrothermal Characteristics of IGBTs During Thermal Cycling Cocaused by Solder Cracking and Al-Wires Lifting-Off Based on Iterative Looping-Reference-Cited by-同舟云学术

Evaluation of the Degradation in Electrothermal Characteristics of IGBTs During Thermal Cycling Cocaused by Solder Cracking and Al-Wires Lifting-Off Based on Iterative Looping

Published:2023-02 Issue:2 Volume:38 Page:1768-1778
ISSN:0885-8993
Container-title:IEEE Transactions on Power Electronics
language:
Short-container-title:IEEE Trans. Power Electron.

Author:

Huang Yongle¹^ORCID,Luo Yifei¹,Xiao Fei¹,Liu Binli¹,Tang Xin¹

Affiliation:

1. National Key Laboratory of Science and Technology on Vessel Integrated Power System, Naval University of Engineering, Wuhan, China

Funder

JCJQ Program

National Defense Science and Technology Key Laboratory Foundation

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Link

http://xplorestaging.ieee.org/ielx7/63/9952160/09903334.pdf?arnumber=9903334

Reference43 articles.

1. Failure Mechanism of Die-Attach Solder Joints in IGBT Modules Under Pulse High-Current Power Cycling

2. A Multi-timescale Prediction Model of IGBT Junction Temperature

3. A combined physicochemical-microstructural approach to predict the crack path at the topside interconnections in IGBT power devices

4. A Lifetime Prediction Method for IGBT Modules Considering the Self-Accelerating Effect of Bond Wire Damage

5. Improved Lifetime Prediction Model of IGBT Module Considering Aging Effect of Solder Layer

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Parameter Correction Method of Vce(on)-Based Junction Temperature Estimation Model Based on Bonding Wire Fatigue;IEEE Journal of Emerging and Selected Topics in Power Electronics;2024-08

2. Evaluation on the electro-thermal instability process of thermal runaway under high temperature based on TCAD;Microelectronics Reliability;2024-03

3. A Probabilistic Bayesian Machine Learning Framework for Comprehensive Characterization of Bond Wires in IGBT Modules Under Thermomechanical Loadings;Journal of Electronic Materials;2023-12-21

4. Junction Temperature Estimation Technologies of IGBT Modules in Converter-Based Applications;IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society;2023-10-16

5. Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO₂ composite solder paste;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27