Improved Lifetime Prediction Model of IGBT Module Considering Aging Effect of Solder Layer-Reference-Cited by-同舟云学术

Improved Lifetime Prediction Model of IGBT Module Considering Aging Effect of Solder Layer

Published:2021-12-18 Issue: Volume: Page:
ISSN:
Container-title:2021 11th International Conference on Power and Energy Systems (ICPES)
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Author:

Long Liu,Tu Chunming,Xiao Biao,Xu Haoliang,Liu Shuaihu

Funder

National Key R&D Program of China

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9682672/9683793/09683869.pdf?arnumber=9683869

Reference15 articles.

1. Reliability prediction for IGBT solder joints using Clech Algorithm

2. Modelling for the lifetime prediction of power semiconductor modules;kovacevic-badstuebner;Reliability of Power Electronic Converter Systems IET,2016

3. Lifetime Prediction of IGBT Modules in Suspension Choppers of Medium/Low-Speed Maglev Train Using an Energy-Based Approach

4. Study on board-level drop impact reliability of Sn-Ag-Cu solder joint by considering strain rate dependent properties of solder;fa;IEEE Transactions on Device and Materials Reliability,2015

5. Experimental Investigation on the Effects of Narrow Junction Temperature Cycles on Die-Attach Solder Layer in an IGBT Module

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1. An Improved Stress-strain Model Considering the Aging Effect of Solder Layers;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17

2. Investigation on reproduction of IGBT die-attach solder degradation with finite element thermal-mechanical simulation;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17

3. Enhancing the Resilience of Medical Equipment with Innovative IGBT Protection Strategies in Modern Smart Grid Ecosystems;2024 9th Asia Conference on Power and Electrical Engineering (ACPEE);2024-04-11

4. Evaluation of the Degradation in Electrothermal Characteristics of IGBTs During Thermal Cycling Cocaused by Solder Cracking and Al-Wires Lifting-Off Based on Iterative Looping;IEEE Transactions on Power Electronics;2023-02