An Improved Stress-strain Model Considering the Aging Effect of Solder Layers
Author:
Affiliation:
1. Xian Jiaotong University,College of Electrical Engineering,Xian,China
2. State Grid Shanghai Electric Power Research Institute,Shanghai,China
Funder
Science and Technology Project of State Grid
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10567049/10567050/10567492.pdf?arnumber=10567492
Reference10 articles.
1. A Lifetime Prediction Method for IGBT Modules Considering the Self-Accelerating Effect of Bond Wire Damage
2. Catastrophic failure and fault-tolerant design of IGBT power electronic converters - an overview
3. Stress-Based Model for Lifetime Estimation of Bond Wire Contacts Using Power Cycling Tests and Finite-Element Modeling
4. Reliability prediction for IGBT solder joints using Clech Algorithm
5. Lifetime Prediction of IGBT Modules in Suspension Choppers of Medium/Low-Speed Maglev Train Using an Energy-Based Approach
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