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Lifetime Prediction of IGBT Modules in Suspension Choppers of Medium/Low-Speed Maglev Train Using an Energy-Based Approach

  • Published:2019-01 Issue:1 Volume:34 Page:738-747
  • ISSN:0885-8993
  • Container-title:IEEE Transactions on Power Electronics
  • language:
  • Short-container-title:IEEE Trans. Power Electron.

Author:

Yang XinORCID,Lin ZhikaiORCID,Ding Jingfang,Long Zhiqiang

Funder

National Natural Science Foundation of China

13th Five-Year National Key R&D Program of China

Maglev Technology Research Center of Hunan Province, China

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering

Cited by 39 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An Improved Stress-strain Model Considering the Aging Effect of Solder Layers;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17

2. Investigation on reproduction of IGBT die-attach solder degradation with finite element thermal-mechanical simulation;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17

3. Robust Adaptive Fault-tolerant Asymptotic Tracking Control for Magnetic Levitation System Based on Nussbaum Gain and Neural Network;International Journal of Control, Automation and Systems;2024-01

4. Failure Mode Classification of IGBT Modules Under Power Cycling Tests Based on Data-Driven Machine Learning Framework;IEEE Transactions on Power Electronics;2023-12

5. Mechanical behaviors of the U-girder for urban maglev transit under temperature loads and train loads;Journal of Vibration and Control;2023-11-11
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