Reliability prediction for IGBT solder joints using Clech Algorithm
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/7574980/7583073/07583309.pdf?arnumber=7583309
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. An Improved Stress-strain Model Considering the Aging Effect of Solder Layers;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17
2. Lifetime Prediction Method of the Traction Converter IGBT Based on Plastic Strain Energy Density;IEEE Transactions on Transportation Electrification;2023
3. Improved Lifetime Prediction Model of IGBT Module Considering Aging Effect of Solder Layer;2021 11th International Conference on Power and Energy Systems (ICPES);2021-12-18
4. Investigation on Inelastic Strain Energy of IGBT Solder Layers During Aging by the Clech Algorithm;2020 IEEE 9th International Power Electronics and Motion Control Conference (IPEMC2020-ECCE Asia);2020-11-29
5. Lifetime Prediction of IGBT Modules in Suspension Choppers of Medium/Low-Speed Maglev Train Using an Energy-Based Approach;IEEE Transactions on Power Electronics;2019-01
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