Investigation on Inelastic Strain Energy of IGBT Solder Layers During Aging by the Clech Algorithm
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Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9367608/9367628/09368050.pdf?arnumber=9368050
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. An Improved Stress-strain Model Considering the Aging Effect of Solder Layers;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17
2. Investigation on reproduction of IGBT die-attach solder degradation with finite element thermal-mechanical simulation;2024 IEEE 10th International Power Electronics and Motion Control Conference (IPEMC2024-ECCE Asia);2024-05-17
3. A Computationally Efficient IGBT Lifetime Prediction Method Based on Successive Initiation Technique by Iteratively Using Clech Algorithm;IEEE Journal of Emerging and Selected Topics in Power Electronics;2023-06
4. Crack Identification by Digital Image Correlation Method Using Crack Shape as Prior Information;Journal of Pressure Vessel Technology;2023-05-31
5. Failure Mechanism Investigation of Die-Attach Solder Based on the Birth and Death Technology;2022 International Power Electronics Conference (IPEC-Himeji 2022- ECCE Asia);2022-05-15
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