A Computationally Efficient IGBT Lifetime Prediction Method Based on Successive Initiation Technique by Iteratively Using Clech Algorithm
Author:
Affiliation:
1. College of Electrical and Information Engineering, Hunan University, Changsha, China
2. CRRC Zhuzhou Electric Locomotive Institute Company Ltd., Zhuzhou, China
Funder
National Natural Science Foundation of China
Huxiang High-level Talent Gathering Project
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Energy Engineering and Power Technology
Link
http://xplorestaging.ieee.org/ielx7/6245517/10149883/10042429.pdf?arnumber=10042429
Reference45 articles.
1. Failure Mechanism of Die-Attach Solder Joints in IGBT Modules Under Pulse High-Current Power Cycling
2. In Situ Diagnostics and Prognostics of Wire Bonding Faults in IGBT Modules for Electric Vehicle Drives
3. A heat energy dissipation approach to elastic-plastic fatigue crack propagation
4. Improving Power Converter Reliability: Online Monitoring of High-Power IGBT Modules
5. Reliability estimation for large-area solder joints using explicit modeling of damage
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1. Effect of solder junction void variation in power semiconductor package on power cycle lifetime;Microelectronics Reliability;2024-10
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