Author:
Shqair M.,Khatir Z.,Ibrahim A.,Berkani M.,Halouani A.,Hamieh T.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference34 articles.
1. Electro-thermal-mechanical modeling of wire bonding failures in IGBT;Tseng,2013
2. Shigley's Mechanical Engineering Design;Budynas,2008
3. Thermo-mechanical stress of bonded wires used in high power modules with alternating and direct current modes;Medjahed;Microelectron. Reliab.,2012
4. Theory of linear facet growth during thermal etching;Mullins;Philos. Mag.,1961
5. Fatigue and thermal fatigue damage analysis of thin metal films;Zhang;Microelectron. Reliab.,2007
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3 articles.
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