Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO2 composite solder paste
Author:
Affiliation:
1. Gdynia Maritime University,Department of Marine Electronics,Gdynia,Poland
2. Budapest University of Technology and Economics,Department of Electronics Technology,Budapest,Hungary
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10325669/10325677/10325884.pdf?arnumber=10325884
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1. In-Situ Extraction of the Thermal Impedance of GaN Power HEMTs Embedded in PCB-based Power Circuits
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3. Optimized Kilowatt-Range Boost Converter Based on Impulse Rectification With 52 kW/l and 98.6% Efficiency
4. Experimental Validation of Analytical Models for Through-PCB Thermal Vias
5. Thermomechanical behaviour of environmentally benign Pb-free solders
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Influence of the selection of the approximating function of thermometric characteristics on the measurement results of thermal resistance of power mosfets;Metrology and Measurement Systems;2024-08-19
2. Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of power components;Soldering & Surface Mount Technology;2024-07-09
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