Author:
Yang Chen ,Guozhu Chen ,Keyue Smedley
Cited by
2 articles.
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1. Reliability tests of the surface-mounted power MOSFETs soldered using SAC0307-TiO2 composite solder paste;2023 29th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC);2023-09-27
2. Thermal Characterisation of Insulating Layers in Metal Core PCB;2021 28th International Workshop on Electric Drives: Improving Reliability of Electric Drives (IWED);2021-01-27