Novel Press-Pack Power Diode DBW3-3500 With Integrated Microchannel Cooling System
Author:
Affiliation:
1. Department of Semiconductor and Optoelectronic Devices, Lodz University of Technology, Lodz, Poland
2. Łukasiewicz Research Network-Institute of Electrical Engineering, Warsaw, Poland
Funder
Ministry of Science and Higher Education in Poland
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/63/10159460/10121606.pdf?arnumber=10121606
Reference29 articles.
1. Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices
2. Benchmarking Study on the Thermal Management Landscape for Three-Dimensional Integrated Circuits: From Back-Side to Volumetric Heat Removal
3. Numerical Investigation of Micro-channel based Active Module Cooling for Solar CPV System
4. Experimental and Numerical Thermal Analysis of Multi-Layered Microchannel Heat Sink for Concentrating Photovoltaic Application
5. How to change the landscape of power electronics with wide bandgap power devices
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