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Development of a Compact and Efficient Liquid Cooling System With Silicon Microcooler for High-Power Microelectronic Devices

  • Published:2016-05 Issue:5 Volume:6 Page:729-739
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Tang Gongyue,Han Yong,Lau Boon Long,Zhang Xiaowu,Rhee Daniel Min Woo

Funder

Silicon Micro Cooler (SMC) consortium project, and the consortium members include Honeywell Aerospace and Element Six Technologies

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Piezoelectric micropump cooler for high-power electronic cooling;International Journal of Heat and Mass Transfer;2024-11

2. Liquid Cooling for High‐Heat‐Flux Electronic Devices;Thermal Management for Opto‐electronics Packaging and Applications;2024-05-31

3. Novel Press-Pack Power Diode DBW3-3500 With Integrated Microchannel Cooling System;IEEE Transactions on Power Electronics;2023-08

4. A compact jet array impingement cooling system driven by integrated piezoelectric micropump;International Journal of Heat and Mass Transfer;2023-05

5. A miniature piezoelectric pump with high performance;AIP Advances;2022-06-01
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