Virtual Prototyping Approach for Package Delamination Risk Assessment under Simulated High Temperature Exposure using Finite Element Analysis
Author:
Affiliation:
1. Infineon Technologies Malaysia Sdn. Bhd.,IFMY BE DEV I SIM,Melaka,Malaysia
2. Infineon Technologies AG.,IFAG BE DEV I SIM TM,Neubiberg,Germany
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9969384/9969385/09969510.pdf?arnumber=9969510
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4. Effect of Aging of Packaging Materials on Die Surface Cracking of a SiP Carrier;ma;EuroSimE 2008 - Int Conf Therm Mech Multi-Phys Simul Exp Microelectron Micro-Syst,2008
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Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging;Journal of Electronic Packaging;2024-01-12
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