Effect of high temperature aging on reliability of automotive electronics-Reference-Cited by-同舟云学术

Effect of high temperature aging on reliability of automotive electronics

Published:2011-09 Issue:9-11 Volume:51 Page:1938-1942
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Yang D.G.,Wan F.F.,Shou Z.Y.,van Driel W.D.,Scholten H.,Goumans L.,Faria R.

Funder

Guangxi Natural Science Foundation Program

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Reliability challenges of automotive power electronics;Scheuermann;Microelectron Reliab,2009

2. Zhu WH, Gan SL, Toh CL. Mechanical properties of molding compounds (MCs) under different moisture conditions and in a wide temperature range. In: 5th Int Conj EuroSimE; 2004.

3. Gallo A. Effectors of high temperature reliability in epoxy encapsulated devices. In: Proceedings of the 43rd ECTC; 1993. p. 356–66.

4. Noijena S, Engelena R, Martensb J, Oprana A, van der Sluis O. On the epoxy moulding compound aging effect on package reliability. In: Proceedings of EuroSimE 2009.

5. Alexander Teverovsky, Effect of environments on degradation of molding compound and wire bonds in PEMs. In: Proceedings of ECTC; 2006. p. 1415–24.

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