Effect of Thermal and Mechanical Stresses on Novel Microstrip Lines Printed on Flexible Substrates-Reference-Cited by-同舟云学术

Effect of Thermal and Mechanical Stresses on Novel Microstrip Lines Printed on Flexible Substrates

Published:2024-08 Issue:8 Volume:14 Page:1481-1492
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Obeidat Abdullah S.¹^ORCID,Enakerakpo Emuobosan¹^ORCID,Umar Ashraf²,Al-Shaibani Waleed¹,Abdelatty Mohamed¹^ORCID,Lieberman Sara¹^ORCID,Noruz Shamsian Olya²^ORCID,Al-Haidari Riadh¹^ORCID,Alhendi Mohammed¹^ORCID,Poliks Mark D.³^ORCID

Affiliation:

1. Department of Systems Science and Industrial Engineering, The State University of New York, Binghamton, NY, USA

2. Department of Electrical and Computer Engineering, The State University of New York, Binghamton, NY, USA

3. Department of Systems Science and Industrial Engineering and the Materials Science and Engineering Program, The State University of New York, Binghamton, NY, USA

Funder

Honeywell Federal Manufacturing and Technologies, LLC, which operates the Kansas City National Security Campus for the United States Department of Energy/National Nuclear Security Administration

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

https://ieeexplore.ieee.org/ielam/5503870/10675732/10553325-aam.pdf

Reference64 articles.

1. A New Frontier of Printed Electronics: Flexible Hybrid Electronics

2. Printed Electronics: Materials, Technologies and Applications Zheng Cui

3. Heterogeneous Integration of Surface Mounted Devices for Bendable Electronics

4. Mechanical and Ka-Band Electrical Reliability Testing of Interconnects in 5G Wearable System-on-Package Designs Under Bending

5. RF performance of ink-jet printed microstrip lines on rigid and flexible substrates