RF performance of ink-jet printed microstrip lines on rigid and flexible substrates-Reference-Cited by-同舟云学术

RF performance of ink-jet printed microstrip lines on rigid and flexible substrates

Published:2017-01 Issue: Volume:168 Page:82-88
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Sim Sung-min,Lee Yeonsu,Kang Hye-Lim,Shin Kwon-Yong,Lee Sang-Ho,Kim Jung-Mu

Funder

Ministry of Trade, Industry and Energy

National Research Foundation of Korea

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference21 articles.

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2. Inkjet-printed antennas, sensors and circuits on paper substrate;Kim;IET Microwaves Antennas Propag.,2013

3. Optimization of inkjet printing of patch antennas on low-cost fibrous substrates;Saghlatoon;IEEE Antennas Wirel. Propag. Lett.,2014

4. All-inkjet-printed flexible electronics fabrication on a polymer substrate by low-temperature high-resolution selective laser sintering of metal nanoparticles;Ko;Nanotechnology,2007

5. Technologies for Printing Sensors and Electronics over Large Flexible Substrates: a review;Khan;IEEE Sensors J.,2015

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1. Effect of Thermal and Mechanical Stresses on Novel Microstrip Lines Printed on Flexible Substrates;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-08

2. Experimental and Modeling Study of RF Performance of a Screen-Printed Coplanar Waveguide (CPW) up to 20 GHz Under Monotonic Stretching;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

3. A vibrating membrane ejector for direct ink writing of printed electronics;Flexible and Printed Electronics;2024-05-16

4. Assessment of the Robustness of Flexible Antennas to Complex Deformations;IEEE Transactions on Antennas and Propagation;2023-06

5. Performance Evaluation of RF Novel Microstrip Lines Printed on Flexible Substrates;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05