Advanced viscoelastic material model for predicting warpage of a QFN panel-Reference-Cited by-同舟云学术

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Advanced viscoelastic material model for predicting warpage of a QFN panel

Published:2008-05 Issue: Volume: Page:
ISSN:
Container-title:2008 58th Electronic Components and Technology Conference
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Author:

de Vreugd J.,Jansen K.M.B.,Xiao A.,Ernst L.J.,Bohm C.,Kessler A.,Preu H.,Stecher M.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx5/4542565/4549927/04550196.pdf?arnumber=4550196

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Prediction of Packaging Induced-Warpage for a 3D Stacked Package with a Cure-dependent Viscoelastic Model for EMC;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

2. Analysis of warpage of a flip-chip BGA package under thermal loading: Finite element modelling and experimental validation;Microelectronic Engineering;2023-03

3. Virtual Prototyping Approach for Package Delamination Risk Assessment under Simulated High Temperature Exposure using Finite Element Analysis;2022 IEEE 39th International Electronics Manufacturing Technology Conference (IEMT);2022-10-19

4. Effect of critical properties of epoxy molding compound on warpage prediction: A critical review;Microelectronics Reliability;2022-03

5. Why Is It Still Difficult to Make Accurate Prediction of the Warpage after Advanced Molding Processes?;2021 IEEE 71st Electronic Components and Technology Conference (ECTC);2021-06

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