Effect of critical properties of epoxy molding compound on warpage prediction: A critical review-Reference-Cited by-同舟云学术

Effect of critical properties of epoxy molding compound on warpage prediction: A critical review

Published:2022-03 Issue: Volume:130 Page:114480
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Phansalkar Sukrut Prashant,Kim Changsu,Han Bongtae

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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5. Warpage characterization of panel fan-out (P-FO) package;Liu,2014

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