Why Is It Still Difficult to Make Accurate Prediction of the Warpage after Advanced Molding Processes?
Author:
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501569.pdf?arnumber=9501569
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
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2. Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-10
3. Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound;Polymer Testing;2023-08
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5. Effects of High-Temperature Exposure on the Thermo-Mechanical Behavior of Epoxy Molding Compound and Warpage of Molded Wafers;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
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