5G and AI Integrated High Performance Mobile SoC Process-Design Co-Development and Production with 7nm EUV FinFET Technology

Author:

Deng Jie,Roh Ukjin,Bao Jerry,Suh Youseok,Choi Jihong,Chen Ying,Lin Vicki,Cheng Jason,Song Zhimin,Cai Ming,Ge Lixin,Chen Gary,Kim Leo,Wang Hao,Song S. C.,Sharma Deepak,Wang Xiao-Yong,Song Byungmoo,Masuoka Yuri Y.,Lee Kwon,Kim Sungwon,Lee Jinkyu,Jin Hyejun,Boynapalli Venu,Narayanan Rajagopal,Penzes Paul,Nallapati Giri,Chidambaram Chidi

Publisher

IEEE

Cited by 7 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Redefining Innovation: A Journey forward in New Dimension Era;2023 International Electron Devices Meeting (IEDM);2023-12-09

2. High Performance 5G mobile SoC Design-Technology Co-Optimization for PPA and Manufacturability with 5nm EUV FinFET technology;2022 International Electron Devices Meeting (IEDM);2022-12-03

3. Simulation of a Crossbar Switch Node by Differential-Taylor Transformation with Risetime Estimation;2022 Moscow Workshop on Electronic and Networking Technologies (MWENT);2022-06-09

4. Fundamentals of Circuit Failure Analysis Based on Optical Fault Isolation Techniques;IEEE Transactions on Device and Materials Reliability;2022-06

5. Photonic crystal L3 cavity laser fabricated using maskless digital photolithography;Nanophotonics;2022-04-11

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