High Performance 5G mobile SoC Design-Technology Co-Optimization for PPA and Manufacturability with 5nm EUV FinFET technology-Reference-Cited by-同舟云学术

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High Performance 5G mobile SoC Design-Technology Co-Optimization for PPA and Manufacturability with 5nm EUV FinFET technology

Published:2022-12-03 Issue: Volume: Page:
ISSN:
Container-title:2022 International Electron Devices Meeting (IEDM)
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Author:

Suh Youseok¹,Bao Jerry¹,Lin Vicki¹,Kuo Wade²,Kim Leo³,Chen Ying¹,Wang Hao¹,Gao Yandong¹,Cheng Jason¹,Wang Xiao-Yong¹,Park Hyuk⁴,Lim Hochul⁴,Kim Sungwon⁴,Shin Hun⁴,Song Byungmoo⁴,Masuoka Yuri Y.⁴,Kim Taegyun⁴,Ku Ja-Hum⁴,Nallapati Giri¹,Yang Sam¹,Chidambaram Pr.¹

Affiliation:

1. Qualcomm Technologies Inc.,San Diego,CA,USA

2. Qualcomm Semiconductor Limited

3. Qualcomm Korea YH

4. Samsung Electronics,Korea

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10019319/10019320/10019545.pdf?arnumber=10019545

Reference5 articles.

1. Cost effective 28nm LP SoC technology optimized with circuit/device/process co-design for smart mobile devices

2. 10nm high performance mobile SoC design and technology co-developed for performance, power, and area scaling;Sam

3. High Performance Mobile SoC Productization with Second-Generation 10-nm FinFET Technology and Extension to 8-nm Scaling

4. 7nm Mobile SoC and 5G Platform Technology and Design Co-Development for PPA and Manufacturability

5. 5G and AI Integrated High Performance Mobile SoC Process-Design Co-Development and Production with 7nm EUV FinFET Technology

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