Fused-Silica Stitch-Chips with Compressible Microinterconnects for Embedded RF/mm-Wave Chiplets
Author:
Affiliation:
1. School of Electrical and Computer Engineering, Georgia Institute of Technology,USA
Funder
The United States Air Force
The National Science Foundation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9865233/9865240/09865270.pdf?arnumber=9865270
Reference8 articles.
1. Bondwire Model and Compensation Network for 60 GHz Chip-to-PCB Interconnects
2. Modelling the shape, length and radiation characteristics of bond wire antennas
3. Design, Fabrication, and Characterization of Dense Compressible Microinterconnects
4. Electrical Characterization and Benchmarking of Polylithic Integration Using Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Applications
5. A W-Band Chip-to-Printed Circuit Board Interconnect
Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Electrical Demonstration of an RF Embedded Multichip Module Enabled by Fused-Silica Stitch-Chip Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07
2. Low-Complexity Parameter Estimation Algorithm Based on Two-Stage QPSO-OMP;2023 Asia-Pacific Microwave Conference (APMC);2023-12-05
3. Sub-THz flexible interconnection technology based on polyimide transmission lines;2023 Asia-Pacific Microwave Conference (APMC);2023-12-05
4. Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Chiplet-Based Modules;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-07
5. Embedded mm-Wave Chiplet Based Module using Fused-Silica Stitch-Chip Technology: RF Characterization and Thermal Evaluation;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3