Embedded mm-Wave Chiplet Based Module using Fused-Silica Stitch-Chip Technology: RF Characterization and Thermal Evaluation
Author:
Affiliation:
1. Sch. Electr. Comp. Eng. Georgia Institute of Technology,Atlanta,GA
Funder
National Science Foundation
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195400.pdf?arnumber=10195400
Reference12 articles.
1. Thermomechanical Analysis and Package-Level Optimization of Mechanically Flexible Interconnects for Interposer-on- Motherboard Assembly
2. A W-Band Chip-to-Printed Circuit Board Interconnect
3. Mechanical Engineering
4. Additively Manufactured mm-Wave Multichip Modules With Fully Printed “Smart” Encapsulation Structures
5. Bondwire Model and Compensation Network for 60 GHz Chip-to-PCB Interconnects
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