A W-Band Chip-to-Printed Circuit Board Interconnect-Reference-Cited by-同舟云学术

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A W-Band Chip-to-Printed Circuit Board Interconnect

Published:2020-08 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE/MTT-S International Microwave Symposium (IMS)
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Author:

Deutschmann Bjorn,Jacob Arne F.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9212188/9223768/09223815.pdf?arnumber=9223815

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Chiplet-Based Modules;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-07

2. Embedded mm-Wave Chiplet Based Module using Fused-Silica Stitch-Chip Technology: RF Characterization and Thermal Evaluation;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Fused-Silica Stitch-Chips with Compressible Microinterconnects for Embedded RF/mm-Wave Chiplets;2022 IEEE/MTT-S International Microwave Symposium - IMS 2022;2022-06-19

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