Bondwire Model and Compensation Network for 60 GHz Chip-to-PCB Interconnects
Author:
Funder
Bundesministerium fr Bildung und Forschung
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering
Link
http://xplorestaging.ieee.org/ielx7/7727/9616477/09525269.pdf?arnumber=9525269
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Measurement of Broadband IF-over-Fiber Link for 60 GHz Wireless Applications;Journal of Infrared, Millimeter, and Terahertz Waves;2024-08-17
2. Electrical Demonstration of an RF Embedded Multichip Module Enabled by Fused-Silica Stitch-Chip Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07
3. A Low-Cost 60-GHz Modular Front-End Design for Channel Sounding;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-02
4. A 60-GHz Antenna-Duplexed Modular Front-End for Channel Sounding and Physical Layer Security;IEEE Transactions on Circuits and Systems I: Regular Papers;2024
5. Characterization and Performance Improvement of Bondwire Interconnects in QFN Packages for Bandpass mm-Wave Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-01
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