Characterization and Performance Improvement of Bondwire Interconnects in QFN Packages for Bandpass mm-Wave Applications-Reference-Cited by-同舟云学术

Characterization and Performance Improvement of Bondwire Interconnects in QFN Packages for Bandpass mm-Wave Applications

Published:2024-01 Issue:1 Volume:14 Page:71-80
ISSN:2156-3950
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
language:
Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Namaki Pouya¹^ORCID,Masoumi Nasser²^ORCID,Nezhad-Ahmadi Mohammad-Reza³^ORCID

Affiliation:

1. Department of Electronics, School of Electrical and Computer Engineering, College of Engineering, Circuits and Systems and Test Laboratory (CST-Lab), University of Tehran, Tehran, Iran

2. Department of Electronics, School of Electrical and Computer Engineering, College of Engineering, University of Tehran, Tehran, Iran

3. Department of Electrical and Computer Engineering, University of Waterloo, Waterloo, ON, Canada

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Link

http://xplorestaging.ieee.org/ielx7/5503870/10452142/10387525.pdf?arnumber=10387525

Reference39 articles.

1. Radiation Pattern Optimization for QFN Packages With On-Chip Antennas at 160 GHz

2. Full Chip-Package-Board Co-Design of Broadband QFN Bonding Transition Using Backside via and Defected Ground Structure

3. Packaging effects on a CMOS low-noise amplifier: Flip-chip versus wirebond

4. The Design of CMOS Radio-Frequency Integrated Circuits

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