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Thermomechanical Analysis and Package-Level Optimization of Mechanically Flexible Interconnects for Interposer-on- Motherboard Assembly

  • Published:2018-12 Issue:12 Volume:8 Page:2081-2089
  • ISSN:2156-3950
  • Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
  • language:
  • Short-container-title:IEEE Trans. Compon., Packag. Manufact. Technol.

Author:

Hossen Md ObaidulORCID,Gonzalez Joe L.ORCID,Bakir Muhannad S.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Industrial and Manufacturing Engineering,Electronic, Optical and Magnetic Materials

Cited by 8 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Electrical Demonstration of an RF Embedded Multichip Module Enabled by Fused-Silica Stitch-Chip Technology;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-07

2. Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Chiplet-Based Modules;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-07

3. Embedded mm-Wave Chiplet Based Module using Fused-Silica Stitch-Chip Technology: RF Characterization and Thermal Evaluation;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Multi-Package Co-Design for Chiplet Integration;Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design;2022-10-30

5. Polylithic Integrated Circuits using 2.5D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations;Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces;2021-12-03
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