Multi-Package Co-Design for Chiplet Integration-Reference-Cited by-同舟云学术

Multi-Package Co-Design for Chiplet Integration

Published:2022-10-30 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 41st IEEE/ACM International Conference on Computer-Aided Design
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Author:

Zhuang Zhen¹,Yu Bei¹,Chao Kai-Yuan²,Ho Tsung-Yi¹

Affiliation:

1. The Chinese University of Hong Kong

2. Huawei Technology Investment Co. Ltd.

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3508352.3549404

Reference23 articles.

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2. I. H.-R. Jiang , Y.-W. Chang , J.-L. Huang , and C. C.-P. Chen , " Intelligent Design Automation for Heterogeneous Integration ," in Proceedings of International Symposium on Physical Design (ISPD) , pp. 105 -- 106 , 2022 . I. H.-R. Jiang, Y.-W. Chang, J.-L. Huang, and C. C.-P. Chen, "Intelligent Design Automation for Heterogeneous Integration," in Proceedings of International Symposium on Physical Design (ISPD), pp. 105--106, 2022.

3. Chiplet actuary

4. M. Ahmad , J. DeLaCruz , and A. Ramamurthy , " Heterogeneous Integration of Chiplets: Cost and Yield Tradeoff Analysis," in Proceedings of International Conference on Thermal , Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) , pp. 1 -- 9 , 2022 . M. Ahmad, J. DeLaCruz, and A. Ramamurthy, "Heterogeneous Integration of Chiplets: Cost and Yield Tradeoff Analysis," in Proceedings of International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), pp. 1--9, 2022.

5. T. Hayashi P. Y. Lin R. Watanabe and S. Ichikawa "Development of Highly Reliable Crack Resistive Build-up Dielectric Material with Low Df Characteristic for Next-Gen 2.5D Packages " in Proceedings of IEEE Electronic Components and Technology Conference (ECTC) pp. 570--576 2021. T. Hayashi P. Y. Lin R. Watanabe and S. Ichikawa "Development of Highly Reliable Crack Resistive Build-up Dielectric Material with Low Df Characteristic for Next-Gen 2.5D Packages " in Proceedings of IEEE Electronic Components and Technology Conference (ECTC) pp. 570--576 2021.

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