Chiplet actuary-Reference-Cited by-同舟云学术

Chiplet actuary

Published:2022-07-10 Issue: Volume: Page:
ISSN:
Container-title:Proceedings of the 59th ACM/IEEE Design Automation Conference
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Author:

Feng Yinxiao¹,Ma Kaisheng¹

Affiliation:

1. Tsinghua University, Beijing, China

Publisher

ACM

Link

https://dl.acm.org/doi/pdf/10.1145/3489517.3530428

Reference14 articles.

1. The use and evaluation of yield models in integrated circuit manufacturing

2. Ian Cutress. 2020. better yield on 5nm than 7nm tsmc update on defect rates for n5. https://www.anandtech.com/show/16028/better-yield-on-5nm-than-7nm-tsmc-update-on-defect-rates-for-n5 Ian Cutress. 2020. better yield on 5nm than 7nm tsmc update on defect rates for n5. https://www.anandtech.com/show/16028/better-yield-on-5nm-than-7nm-tsmc-update-on-defect-rates-for-n5

3. Saif Khan and Alexander Mann. 2020. AI Chips: What They Are and Why They Matter: An AI Chips Reference. https://cset.georgetown.edu/publication/ai-chips-what-they-are-and-why-they-matter/ Saif Khan and Alexander Mann. 2020. AI Chips: What They Are and Why They Matter: An AI Chips Reference. https://cset.georgetown.edu/publication/ai-chips-what-they-are-and-why-they-matter/

4. Tao Li , Jie Hou , Jinli Yan , Rulin Liu , Hui Yang , and Zhigang Sun . 2020. Chiplet Heterogeneous Integration Technology---Status and Challenges. Electronics ( 2020 ). Tao Li, Jie Hou, Jinli Yan, Rulin Liu, Hui Yang, and Zhigang Sun. 2020. Chiplet Heterogeneous Integration Technology---Status and Challenges. Electronics (2020).

5. IC Knowledge LLC. 2020. IC Cost and Price Model ; Assembly and Test Cost and Price Model . IC Knowledge LLC. 2020. IC Cost and Price Model; Assembly and Test Cost and Price Model.

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1. Hardware Specialization: Estimating Monte Carlo Cross-Section Lookup Kernel Performance and Area;Proceedings of the SC '23 Workshops of The International Conference on High Performance Computing, Network, Storage, and Analysis;2023-11-12

2. Monad: Towards Cost-Effective Specialization for Chiplet-Based Spatial Accelerators;2023 IEEE/ACM International Conference on Computer Aided Design (ICCAD);2023-10-28

3. Heterogeneous Die-to-Die Interfaces: Enabling More Flexible Chiplet Interconnection Systems;56th Annual IEEE/ACM International Symposium on Microarchitecture;2023-10-28

4. A 25‐Gb/s/pin ground‐referenced signaling transceiver with a DC‐coupled equalizer for on‐package communication;International Journal of Circuit Theory and Applications;2023-09-06

5. HexaMesh: Scaling to Hundreds of Chiplets with an Optimized Chiplet Arrangement;2023 60th ACM/IEEE Design Automation Conference (DAC);2023-07-09