Low leakage and low variability Ultra-Thin Body and Buried Oxide (UT2B) SOI technology for 20nm low power CMOS and beyond

Author:

Andrieu F.,Weber O.,Mazurier J.,Thomas O.,Noel J-P.,Fenouillet-Beranger C.,Mazellier J-P.,Perreau P.,Poiroux T.,Morand Y.,Morel T.,Allegret S.,Loup V.,Barnola S.,Martin F.,Damlencourt J-F.,Servin I.,Casse M.,Garros X.,Rozeau O.,Jaud M-A.,Cibrario G.,Cluzel J.,Toffoli A.,Allain F.,Kies R.,Lafond D.,Delaye V.,Tabone C.,Tosti L.,Brevard L.,Gaud P.,Paruchur V.,Bourdelle K.K.,Schwarzenbach W.,Bonnin O.,Nguyen B-Y.,Doris B.,Boeuf F.,Skotnicki T.,Faynot O.

Publisher

IEEE

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1. CMOS Scaling for the 5 nm Node and Beyond: Device, Process and Technology;Nanomaterials;2024-05-09

2. Investigation of Self-Heating Effect on the Void Embedded SOI MOSFETs;2024 8th IEEE Electron Devices Technology & Manufacturing Conference (EDTM);2024-03-03

3. Impact of Back-Gate Radiation on Single-Event Effects of Ultrathin Body and Buried Oxide Fully Depleted Silicon-on-Insulator MOSFETs;Journal of Electronic Materials;2023-08-30

4. Thermal Evaluation of 28-nm p-type FD-SOI MOSFETs;2023 IEEE Latin American Electron Devices Conference (LAEDC);2023-07-03

5. Advanced Technologies for Future Materials and Devices;Springer Handbook of Semiconductor Devices;2022-11-11

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