Degradation Mechanisms of Au–Al Wire Bonds During Qualification Tests at High Temperature for Automotive Applications: Quality Improvement by Process Modification-Reference-Cited by-同舟云学术

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Degradation Mechanisms of Au–Al Wire Bonds During Qualification Tests at High Temperature for Automotive Applications: Quality Improvement by Process Modification

Published:2008-09 Issue:3 Volume:8 Page:484-489
ISSN:1530-4388
Container-title:IEEE Transactions on Device and Materials Reliability
language:
Short-container-title:IEEE Trans. Device Mater. Relib.

Author:

Bahi Manoubi Auguste,Lecuyer Pascal,Gentil Annabelle,Fremont HÉlÈne,Landesman Jean-Pierre,Christien FrÉdÉric,Le Gall RenÉ

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Safety, Risk, Reliability and Quality,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx5/7298/4655569/04655583.pdf?arnumber=4655583

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Extreme temperature packaging: challenges and opportunities;SPIE Proceedings;2016-05-17

2. Interface microstructure effects in Au thermosonic ball bonding contacts by high reliability wire materials;Microelectronics Reliability;2014-09

3. Pushing toward the limits of acceleration: Example on wire-bond assemblies;Microelectronics Reliability;2012-09

4. Wearout estimation using the Robustness Validation methodology for components in 150°C ambient automotive applications;Microelectronics Reliability;2010-09

5. A new methodology for the identification of ball bond degradation during high-temperature aging tests on devices in standard plastic packages;Microelectronics Reliability;2009-09

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