Author:
Lecuyer P.,Fremont H.,Landesman J-P.,Bahi M-A.
Subject
Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Reference10 articles.
1. SAE J1879. Handbook for robustness validation of semiconductor devices in automotive application.
2. ISO-26262. Road vehicle functional safety (draft).
3. AEC-Q100. Stress test qualification for automotive ICs.
4. Sequential environmental stresses tests qualification for automotive components;Bahi;Microelectron Reliab,2007
5. Degradation mechanisms of Au–Al wire bonds during qualification tests at high temperature for automotive applications. Quality improvement by process modification;Bahi;IEEE Trans Dev Mater Reliab,2008
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