Pushing toward the limits of acceleration: Example on wire-bond assemblies-Reference-Cited by-同舟云学术

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Pushing toward the limits of acceleration: Example on wire-bond assemblies

Published:2012-09 Issue:9-10 Volume:52 Page:2306-2309
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Jullien J.B.,Plano B.,Frémont H.

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference8 articles.

1. Metallurgical bonding systems for high-temperature electronics;Harman,1999

2. Fremont H. How to combine experiments and simulations to study thermo-mechanical issues in complex microelectronics assemblies. In: Thermal, Mechanical & Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems. EuroSimE 2010; 2010. p. 1–7.

3. Degradation mechanisms of Au–Al wire bonds during qualification tests at high temperature for automotive applications quality improvement by process modification;Bahi;IEEE Trans Dev Mater Reliab,2008

4. Diffusion kinetics in aluminum-gold bond contacts from first-principles density functional calculations;Ulrich;Acta Mater,2011

5. Huang R, Yee Tan Y, Simulation of diffusion controlled intermetallic formation of Au/Al interface. In: EuroSimE 13th int conf thermal, mechanical and multi-physics simulation and experiments in microelectronics and microsystems; 2012.

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