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Extreme temperature packaging: challenges and opportunities

  • Published:2016-05-17 Issue: Volume: Page:
  • ISSN:0277-786X
  • Container-title:SPIE Proceedings
  • language:
  • Short-container-title:

Author:

Johnson R. Wayne1

Affiliation:

1. Tennessee Technological Univ. (United States)

Publisher

SPIE

Reference111 articles.

1. Integrated Liquid Cooling Automotive IGBT Module for High Temperatures Coolant Application;Wang,2015

2. An intelligent power module with high accuracy control system and direct liquid cooling for Hybrid system;Higuchi,2014

3. Packaging technologies of direct-cooled power module;Kurosu,2010

4. High Temperature Downhole Tools- Recommendations for Enhanced and Supercritical Geothermal Systems;Ásmundsson,2011

5. High Temperature Downhole Tools for Enhanced and Supercritical Geothermal Systems;Ásmundsson,2011

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1. Electromagnetic Stability Characterization of Millimeter-Wave Dielectric Fibers at Extremely High-Temperatures: Enabling Harsh Environment Communication and Sensing;2024 IEEE/MTT-S International Microwave Symposium - IMS 2024;2024-06-16

2. Modeling and Additive Manufacturing of Inductors in Complex Geometries for High Temperature Electronics;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Novel SiO2 Cables With Edge Launch Connectors for High Temperature RF Measurements;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

4. Printed electronics for extreme high temperature environments;Additive Manufacturing;2022-06

5. Methodologies for Millimeter-Wave Circuit Design in Extreme Environments;Lecture Notes in Electrical Engineering;2020
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