Author:
Chen Bichen,Tsiklauri Mikheil,Wu Chunyu,Jin Shuai,Fan Jun,Ye Xiaoning,Samaras Bill
Cited by
12 articles.
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1. Fixture De-Embedding Challenges for Short 2xThru Structure;2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2023-12-12
2. 2x-Thru De-embedding Uncertainty for On-Package High-Speed Interconnects;2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2022-12-12
3. Generalized analytical formulation for de‐embedding of multiport devices based on known fixtures;International Journal of RF and Microwave Computer-Aided Engineering;2022-07-29
4. A 2x-Thru Standard De-embedding Method of Surface Components in High-Speed PCBs;2022 IEEE USNC-URSI Radio Science Meeting (Joint with AP-S Symposium);2022-07-10
5. Assessment of 2x Thru De-embedding Accuracy for Package Transmission Line DUTs;2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS);2020-10