Assessment of 2x Thru De-embedding Accuracy for Package Transmission Line DUTs-Reference-Cited by-同舟云学术

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Assessment of 2x Thru De-embedding Accuracy for Package Transmission Line DUTs

Published:2020-10 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
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Author:

Smith Stephen A.,Zhang Zhichao,Aygun Kemal

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9226677/9231311/09231405.pdf?arnumber=9231405

Cited by 8 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Method for Deembedding the Mounting Pad and Via-Hole Effect in a Test Fixture for Accurate Impedance Measurement of the Surface Mount Device Component;IEEE Transactions on Instrumentation and Measurement;2024

2. Fixture De-Embedding Challenges for Short 2xThru Structure;2023 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2023-12-12

3. An Impedance-Corrected 2x-Thru Calibration;IEEE Microwave and Wireless Technology Letters;2023-12

4. The Bandwidth Limitation of De-Embedding Technique for Microstrip Line Measurement;2023 VTS Asia Pacific Wireless Communications Symposium (APWCS);2023-08

5. 2x-Thru De-embedding Uncertainty for On-Package High-Speed Interconnects;2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS);2022-12-12

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