Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM-Reference-Cited by-同舟云学术

Time-Dependent Electromigration Modeling for Workload-Aware Design-Space Exploration in STT-MRAM

Published:2022-12 Issue:12 Volume:41 Page:5327-5332
ISSN:0278-0070
Container-title:IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
language:
Short-container-title:IEEE Trans. Comput.-Aided Des. Integr. Circuits Syst.

Author:

Mayahinia Mahta¹^ORCID,Tahoori Mehdi¹^ORCID,Komalan Manu Perumkunnil²^ORCID,Zahedmanesh Houman²,Croes Kristof²^ORCID,Marinelli Tommaso³^ORCID,Perez Jose Ignacio Gomez⁴^ORCID,Evenblij Timon²^ORCID,Kar Gouri Sankar²,Catthoor Francky²^ORCID

Affiliation:

1. ITEC-CDNC, Karlsruhe Institute of Technology, Karlsruhe, Germany

2. Silicon Technology System Unit, IMEC VZW, Leuven, Belgium

3. ESAT, Katholieke Universiteit Leuven, Leuven, Belgium

4. Department of Computer Architecture and Automatic Control, Complutense University of Madrid, Madrid, Spain

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Computer Graphics and Computer-Aided Design,Software

Link

http://xplorestaging.ieee.org/ielx7/43/9956950/09732479.pdf?arnumber=9732479

Reference17 articles.

1. Stress evolution due to electromigration in confined metal lines

2. Electromigration recovery modeling and analysis under time-dependent current and temperature stressing

3. Electromigration study of sub-100nm Cu-lines;michelon;Proc Adv Metallization Conf (AMC),2004

4. Electromigration and Thermal Storage Study of Barrierless Co Vias

5. Automatically characterizing large scale program behavior

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1. On-chip Electromigration Sensor for Silicon Lifecycle Management of Nanoscale VLSI;2023 IEEE European Test Symposium (ETS);2023-05-22

2. Electromigration-aware design technology co-optimization for SRAM in advanced technology nodes;2023 Design, Automation & Test in Europe Conference & Exhibition (DATE);2023-04

3. An Efficient Test Strategy for Detection of Electromigration Impact in Advanced FinFET Memories;2022 IEEE International Test Conference (ITC);2022-09