Feasibility Study of Nanotwinned Copper and Adhesive Hybrid Bonding for Heterogeneous Integration-Reference-Cited by-同舟云学术

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Feasibility Study of Nanotwinned Copper and Adhesive Hybrid Bonding for Heterogeneous Integration

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Hsiao Chih-Cheng,Fu Huan-Chun,Chiang Chia-Wen,Lee Ou-Hsiang,Yang Tsung-Yu Ou,Chang Hsiang-Hung

Funder

MOEA, Taiwan, R.O.C.

ITRI

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501854.pdf?arnumber=9501854

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Low-Temperature Polymer Hybrid Bonding with Nanoparticulated Cu and Photosensitive Acrylic Adhesive;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Surface Topography Control for Polymer/Cu Hybrid Bonding;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

3. Research progress of hybrid bonding technology for three-dimensional integration;Microelectronics Reliability;2024-04

4. A Novel Polymer-Based Ultra-High Density Bonding Interconnection;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. A Study on Multi-chip Stacking Process by Novel Dielectric Polymer Adhesive for Cu-Cu Hybrid Bonding;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

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