Low-Temperature Polymer Hybrid Bonding with Nanoparticulated Cu and Photosensitive Acrylic Adhesive-Reference-Cited by-同舟云学术

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Low-Temperature Polymer Hybrid Bonding with Nanoparticulated Cu and Photosensitive Acrylic Adhesive

Published:2024-05-28 Issue: Volume: Page:871-875
ISSN:
Container-title:2024 IEEE 74th Electronic Components and Technology Conference (ECTC)
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Author:

Sakamoto Hirokatsu¹,Teranishi Tadashi²,Nagai Rumi²,Itaya Ryo²,Tamate Hideaki³,Fukushima Takafumi⁴,Happoya Akihiko⁵

Affiliation:

1. Daicel Corporation,Osaka,Japan

2. Daicel Corporation,Hyogo,Japan

3. Tohoku MicroTec (T-Micro) Co., Ltd.,Miyagi,Japan

4. Tohoku University,Department of Mechanical Systems Engineering,Miyagi,Japan

5. Daicel Corporation,Tokyo,Japan

Funder

Research and Development

Technology Development

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10564841/10564831/10565006.pdf?arnumber=10565006

Reference10 articles.

1. Three-dimensional integration scheme with a thermal budget below 300°C

2. Superb sinterability of the Cu paste consisting of bimodal size distribution Cu nanoparticles for low-temperature and pressureless sintering of large-area die attachment and the sintering mechanism

3. A*STAR’s Institute of Microelectronics partners eight semiconductor companies in chip-to-wafer hybrid bonding;Institute of Microelectronics, Press Release,2021

4. Development of a Temporary Bonding Tape Having over 300 degC Thermal Resistance for Cu-Cu Direct Bonding

5. Fabricating 3D integrated CMOS devices by using wafer stacking and via-last TSV technologies

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