Superb sinterability of the Cu paste consisting of bimodal size distribution Cu nanoparticles for low-temperature and pressureless sintering of large-area die attachment and the sintering mechanism
Author:
Affiliation:
1. South China University of Technology,School of Materials Science and Engineering,Guangzhou,China,510640
Funder
National Natural Science Foundation of China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816487.pdf?arnumber=9816487
Reference8 articles.
1. Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding
2. Effect of different sizes of Cu nanoparticles on the shear strength of Cu-Cu joints
3. A highly reliable die bonding approach for high power devices by low temperature pressureless sintering using a novel Cu nanoparticle paste
4. Low-pressure Cu-Cu bonding using in-situ surface-modified microscale Cu particles for power device packaging
5. Superior strength and strengthening mechanism of die attachment joints by using bimodal-sized Cu nanoparticle paste capable of low-temperature pressureless sintering
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1. Low-temperature copper sinter-joining technology for power electronics packaging: A review;Journal of Materials Processing Technology;2024-11
2. Low-Temperature Polymer Hybrid Bonding with Nanoparticulated Cu and Photosensitive Acrylic Adhesive;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28
3. Polymer Hybrid Bonding using Copper-Copper Bonding Materials and Thermosetting Resins for Copper-Copper Bonding at 200–250 °C;2024 International Conference on Electronics Packaging (ICEP);2024-04-17
4. Review on Shear Strength and Reliability of Nanoparticle Sintered Joints for Power Electronics Packaging;Journal of Electronic Materials;2024-03-29
5. Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures;Microelectronics Reliability;2023-11
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