Design of Cu nanoaggregates composed of ultra-small Cu nanoparticles for Cu-Cu thermocompression bonding

Author:

Li Junjie,Liang Qi,Shi Tielin,Fan Ji,Gong Bo,Feng Chen,Fan Jinhu,Liao Guanglan,Tang ZirongORCID

Funder

National Natural Science Foundation of China

Initiative Postdocs Supporting Program of China

National Basic Research Program of China

Program for Changjiang Scholars and Innovative Research Team in University

Publisher

Elsevier BV

Subject

Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials

Reference32 articles.

1. Fine pitch Cu/Sn solid state diffusion bonding for making high yield bump interconnections and its application in 3D integration;Zhang,2010

2. Electromigration-induced Kirkendall voids at the Cu/Cu3Sn interface in flip-chip Cu/Sn/Cu joints;Liu;Appl. Phys. Lett.,2007

3. Transition from flip chip solder joint to 3D IC microbump: its effect on microstructure anisotropy;Tu;Microelectron. Reliab.,2013

4. Surface effect induced Cu-Cu bonding by Cu nanosolder paste;Li;Mater. Lett.,2016

5. Low-temperature and low-pressure Cu-Cu bonding by highly sinterable Cu nanoparticle paste;Li;Nanoscale Res. Lett.,2017

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