Author:
Benkart P.,Munding A.,Kaiser A.,Kohn E.,Heittmann A.,Huebner H.,Ramacher U.
Subject
Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials
Reference9 articles.
1. Concept for diamond 3-D integrated UV sensor;Kaiser;Diam. Relat. Mater.,2006
2. Mikromechanik;Heuberger,1991
3. 3D chip stacking technology using trough-chip interconnects;Benkart;IEEE Des. Test Comput.,2005
4. The electrical properties of anodically grown silicon dioxide films;Beynon;Solid-State,1973
5. Face-to-face chip integration with full metal interface;Huebner,2002
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献