Publisher
Japan Institute of Electronics Packaging
Reference12 articles.
1. 1) 経済産業省:“第5回 半導体・デジタル産業戦略検討会議~デジタル産業基盤のサプライチェーン強靱化に向けて~,”2022
2. 2) 井上啓介:“「ムーアの法則」の進化についての一考察,”J-stage 研究 技術 計画,Vol. 35, No. 2, 2020
3. 3) P. Benkart, A. Munding, A. Kaiser, E. Kohn, A. Heittmann, H. Huebner, and U. Ramacher: "Three-dimensional integration scheme with a thermal budget below 300°C," Sensors and Actuators A: Physical, Vol. 139, pp. 350–355, 2007
4. 4) M. Mariappan, S. Fukuzumi, T. Shibata, H. Hashimoto, J. Bea, M. Koyanagi, and T. Fukushima: "Tight-Pitched 10 µm-Width Solder Joints for c-2-c and c-2-w 3D-Integration in NCF Environment," ECTC 72nd, 2022, pp. 1138–1143
5. 5) Y. Miwa, K. Kumahara, S. Lee, R. Liang, H. Kino, T. Fukushima, and T. Tanaka: "7-µm-thick NCF technology with low-height solder microbump bonding for 3D integration," ECTC 70th, 2020, pp. 1453–1458