Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding-Reference-Cited by-同舟云学术

Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding

Published:2019 Issue:6 Volume:8 Page:P346-P350
ISSN:2162-8769
Container-title:ECS Journal of Solid State Science and Technology
language:en
Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Inoue Fumihiro^ORCID,Peng Lan,Iacovo Serena,Phommahaxay Alain,Verdonck Patrick,Meersschaut Johan,Dara Praveen,Sleeckx Erik,Miller Andy,Beyer Gerald,Beyne Eric

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Reference22 articles.

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4. Combined surface activated bonding using H-containing HCOOH vapor treatment for Cu/Adhesive hybrid bonding at below 200 °C

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