A Novel Polymer-Based Ultra-High Density Bonding Interconnection-Reference-Cited by-同舟云学术

A Novel Polymer-Based Ultra-High Density Bonding Interconnection

Published:2023-05 Issue: Volume: Page:
ISSN:
Container-title:2023 IEEE 73rd Electronic Components and Technology Conference (ECTC)
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Author:

Lin Yu-Min¹,Yang Tsung-Yu Ou²,Lee Ou-Hsiang²,Lee Ching- Kuan²,Ko Hsiu-Kuei²,Chen Yi-Shu²,Chang Hsiang-Hung²,Gallagher Michael³,Gilmore Christopher³,Chuang Po-Yao⁴,Tseng Ying-Chung⁴,Tsai Po-Hao⁴,Huang Po-Chun⁴,Lee Chang-Chun⁵

Affiliation:

1. Industrial Technology Research Institute; National Tsing Hua University,Hsinchu,Taiwan

2. Industrial Technology Research Institute (ITRI),Hsinchu,Taiwan

3. DuPont Electronics and Industrial,Marlborough,U.S.

4. DuPont Electronics and Industrial,Miaoli,Taiwan

5. National Tsing Hua University (NTHU),Hsinchu,Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195301.pdf?arnumber=10195301

Reference20 articles.

1. A Novel Photosensitive Polyimide Adhesive Material for Hybrid Bonding Processing

2. Feasibility Study of Nanotwinned Copper and Adhesive Hybrid Bonding for Heterogeneous Integration

3. Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems

4. Characterization and Application of a Novel Permanent Bonding Material

5. Low temperature bonding using non-conductive adhesive for 3D chip stacking with 30μm-pitch micro solder bump interconnections

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