Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems-Reference-Cited by-同舟云学术

Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems

Published:2022-05 Issue: Volume: Page:
ISSN:
Container-title:2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)
language:
Short-container-title:

Author:

Shirasaka Toshiaki¹,Okuda Tadashi¹,Shibata Tomoaki¹,Yoneda Satoshi²,Matsukawa Daisaku²,Mariappan Murugesan³,Koyanagi Mitsumasa⁴,Fukushima Takafumi⁵

Affiliation:

1. Showa Denko Materials Co., Ltd.,Packaging Solution Center,Kawasaki,Japan

2. HD MicroSystems, Ltd.,Technology Development Center,Hitachi,Japan

3. Tohoku University,Global INTegration Initiative (GINTI), New Industry Creation Hatchery Center (NICHe),Sendai,Japan

4. NICHe Tohoku University,GINTI,Sendai,Japan

5. NICHe Tohoku University,Graduate School of Engineering/Graduate School of Biomedical Engineering /GINTI,Sendai,Japan

Publisher

IEEE

Link

Reference28 articles.

Cited by 22 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

5. Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer Base Adhesive;2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA);2024-04-22