Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer Base Adhesive-Reference-Cited by-同舟云学术

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Advanced Chip on Wafer Hybrid Bonding with Copper/Polymer Base Adhesive

Published:2024-04-22 Issue: Volume: Page:1-2
ISSN:
Container-title:2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)
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Author:

Ouyang Tsung- Yu¹,Lin Yu-Min¹,Chan Yu-Ping¹,Lee Ou-Hsiang.¹,Lee Ching-Kuan¹,Chang Hsiang-Hung¹,Wang Chin-Hung¹,Lo Wei-Chung¹,Chuang Po- Yao²,Tseng Ying-Chung²,Tsai Po-Hao²,Gallagher Michael³,Gilmore Christopher³

Affiliation:

1. Industrial Technology Research Institute,Hsinchu,Taiwan

2. DuPont Electronics and Industrial,Miaoli,Taiwan

3. DuPont Electronics and Industrial,Marlborough,U.S.

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx8/10546337/10546338/10546425.pdf?arnumber=10546425

Reference1 articles.

1. Comprehensive Study on Advanced Chip on Wafer Hybrid Bonding with Copper/Polyimide Systems

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