A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect-Reference-Cited by-同舟云学术

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A Fracture Mechanics Evaluation of the Cu-Polyimide Interface in Fan-Out Redistribution Interconnect

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Liu Wei-Te,Yang Chia-Ming,Chiu Tz-Cheng,Chen Dao-Long,Hsiao Ching-Lin,Tarng David

Funder

Ministry of Science and Technology, ROC

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501705.pdf?arnumber=9501705

Cited by 9 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Semiconductor Fan-Out Polymer Adhesion on Physical Vapor Deposited Copper Coupling Temperature & Humidity Effects;2024 International Conference on Electronics Packaging (ICEP);2024-04-17

2. Quantitative analysis of the interface strength of ultra-thin dielectric films based on fan-out packaging;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

3. A Comprehensive Study of Interface Damage at Cu/Polyimide Interface in Redistribution Layers of Fan-out Wafer Level Packaging;2023 24th International Conference on Electronic Packaging Technology (ICEPT);2023-08-08

4. A Quantitative Evaluation of the Inelastic Energy Absorptions in Cu-Polyimide Interconnect and the Effect on Interface Debond Driving Force;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

5. Significant Hall–Petch effect in micro-nanocrystalline electroplated copper controlled by SPS concentration;Scientific Reports;2023-01-09

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