Quantitative analysis of the interface strength of ultra-thin dielectric films based on fan-out packaging-Reference-Cited by-同舟云学术

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Quantitative analysis of the interface strength of ultra-thin dielectric films based on fan-out packaging

Published:2023-08-08 Issue: Volume: Page:1-6
ISSN:
Container-title:2023 24th International Conference on Electronic Packaging Technology (ICEPT)
language:
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Author:

Sun Zhanxing¹,Ding Fei²,Ma Rui²,Wang Qidong²,Jing Xiangmeng³,Su Meiying²,Cao Liqiang²

Affiliation:

1. University of Chinese Academy of Sciences,Institute of Microelectronics of Chinese Academy of Sciences,Beijing,China

2. Chinese Academy of Sciences,Institute of Microelectronics,Beijing,China

3. Xiaomi Campus,Packaging Engineering Department,Beijing,China

Funder

Chinese Academy of Sciences

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/10491594/10491891/10492268.pdf?arnumber=10492268

Reference20 articles.

1. A unique failure mechanism induced by chip to board interaction on fan-out wafer level package

2. A new integration technology platform: Integrated fan-out wafer-level-packaging for mobile applications

3. Embedded Wafer Level Ball Grid Array (eWLB)

4. Next generation eWLB (embedded wafer level BGA) packaging

5. A Viscoplastic-Based Fatigue Reliability Model for the Polyimide Dielectric Thin Film

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